Head-To-Head Analysis: ANADIGICS (ANAD) & Its Competitors
ANADIGICS (NASDAQ: ANAD) is one of 27 public companies in the “Integrated Circuits” industry, but how does it contrast to its rivals? We will compare ANADIGICS to similar businesses based on the strength of its dividends, valuation, risk, profitability, earnings, analyst recommendations and institutional ownership.
Earnings & Valuation
This table compares ANADIGICS and its rivals top-line revenue, earnings per share and valuation.
|Gross Revenue||Net Income||Price/Earnings Ratio|
|ANADIGICS Competitors||$697.41 million||$99.19 million||410.17|
Insider & Institutional Ownership
56.0% of shares of all “Integrated Circuits” companies are owned by institutional investors. 14.3% of shares of all “Integrated Circuits” companies are owned by company insiders. Strong institutional ownership is an indication that hedge funds, large money managers and endowments believe a stock will outperform the market over the long term.
This table compares ANADIGICS and its rivals’ net margins, return on equity and return on assets.
|Net Margins||Return on Equity||Return on Assets|
This is a breakdown of recent ratings and price targets for ANADIGICS and its rivals, as reported by MarketBeat.com.
|Sell Ratings||Hold Ratings||Buy Ratings||Strong Buy Ratings||Rating Score|
As a group, “Integrated Circuits” companies have a potential upside of 25.40%.
ANADIGICS rivals beat ANADIGICS on 7 of the 7 factors compared.
ANADIGICS Company Profile
ANADIGICS, Inc. is engaged in the designing and manufacturing of radio frequency (RF) semiconductor solutions for infrastructure and mobile communications and data transmission markets. The Company’s product portfolio includes line amplifiers, reverse path amplifiers, power amplifiers (PAs) and front-end integrated circuits (FEIC). The Company designs, develops, and manufactures RFIC’s primarily using GaAs compound semiconductor substrates with various process technologies, including metal semiconductor field effect transistor (MESFET), pseudomorphic high-electron-mobility transistor (pHEMT) and heterojunction bipolar transistor (HBT). The Company’s InGaP-Plus technology, combines InGaP HBT and pHEMT processes on a single substrate and integrates the PA function and the RF active switch function on the same die. Additionally, the Company offers VCSEL process technology. The Company fabricates its ICs in its six-inch diameter GaAs wafer fabrication facility.
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